SEMI Packaging Technology Seminar
SEMI Staffs and ESIPAT members register for free. Contact firstname.lastname@example.org for codes.
Event Date: 28-29 September 2021
Event contact: SEMI Europe Events. Email: email@example.com
Cancellation policy: Registration is final. No refunds possible.
Aiming at facilitating mutual engagement, the SEMI Packaging Technology Seminar will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts, to collectively strengthen the semiconductor back-end industry in Europe.
This is a great opportunity to meet with members of the SEMI integrated Packaging, Assembly and Test Technology Community (SiPAT-TC), pioneered by the European chapter (ESiPAT-TC) established in 2016, learn from the seminar presentations, discuss with suppliers and supply chain partners at the exhibition area, actively network and visit an European OSAT company.
The semiconductor industry is going under massive pressure, facing supply chain interruptions in the global electronics industry for some time.
With the pandemic accelerating digitalization, the unprecedented increase in demand is making strong dependencies more evident than ever before.
The negative impact on the global supply chain, the effect of global trade conflicts, and the discussion around regional sovereignty is currently a burning issue with national politics and industry seeking for independence from other regions by expanding and strengthen local supply chains. This, of course, also affects Semiconductor Packaging, Assembly and Test and will be topic of the event.