Connecting Heterogeneous Systems Summit 2021 Registration
This year, 3D & Systems Summit and MEMS & Imaging Sensors Summit will take place virtually, and co-located.
The summit brings together thought leaders and industry experts from the entire 3D & Systems and packaging and, MEMS/imaging/sensor value chain to discuss the latest advancements in Heterogeneous Integration and sensing technology driving innovation in high end applications.
Three Days | Two Summits | One Ticket
- Technology showcases of innovative new products
- Market updates for semiconductors and applications
- Heterogeneous Integration
- 3D & Systems design
- MEMS & Imaging Sensor Technologies
Event Date: 1-3 September 2021
Event contact: SEMI Europe Events. Email: firstname.lastname@example.org
Cancellation policy: Registration is final. No refunds possible.