Connecting Heterogeneous Systems Summit 2021 Registration

Connecting Heterogeneous Systems Summit 2021 Registration

Member Price: €99
Regular price Non-Member Price: €199 €0

This year, 3D & Systems Summit and MEMS & Imaging Sensors Summit will take place virtually, and co-located.

The summit brings together thought leaders and industry experts from the entire 3D & Systems and packaging and, MEMS/imaging/sensor value chain to discuss the latest advancements in Heterogeneous Integration and sensing technology driving innovation in high end applications.

Three Days | Two Summits | One Ticket

  • Technology showcases of innovative new products
  • Market updates for semiconductors and applications
  • Heterogeneous Integration
  • 3D & Systems design
  • MEMS & Imaging Sensor Technologies

Event Date: 1-3 September 2021

Event contact: SEMI Europe Events. Email:


Cancellation policy: Registration is final. No refunds possible.